nav emailalert searchbtn searchbox tablepage yinyongbenwen piczone journalimg journalInfo searchdiv qikanlogo popupnotification paper paperNew
2001, 04, 35-39+50
电沉积纳米晶体材料的研究现状与发展
基金项目(Foundation):
邮箱(Email):
DOI: 10.19289/j.1004-227x.2001.04.010
摘要:

综述了电沉积纳米金属、纳米合金以及纳米复合材料的制备方法、结构特点、优异性质以及它在材料科学中的应用与发展前景。

Abstract:

Preparation of nano-metal nano alloy and nano complex material by electrodeposition was reviewed, as well as structure characteristics, excellent properties of the deposit and its application forecast.

参考文献

[1] MaedaH .,etal.[J].ApplPhys,1969,8:978.

[2] XiaXH ,SchusterR ,KirchnerV ,ErtlG .[J].ElectroanalChem,1999,461:102.

[3] ErbU ,ElSherikAM ,PalumboG ,etal.[J].NanostrMat,1993,2:383.

[4] 喻敬贤,陈永言,黄清安,等.[J].高等学校化学学报,1999,20:107.

[5] CheungC ,ChungE ,ErbU .[J].MatSciLett,1989,8:865.

[6] OsmolaD ,RenaudE ,ErbU ,WongL ,etal.[J].ProcMatResSocSymp,1993,286:191.

[7] 黄令,许书楷,周绍民,等.[J].应用化学,1999,16:38.

[8] GhoshSK ,GroverAK ,DeyGK ,etal.[J].SurCoatTech,2000,126:48.

[9] TochitskiiTA ,NemtsevichLV ,ShadrovVG .[J].Metally,1998,1:116.

[10] MastaiY ,GalD ,HodesG .[J].ElectrochemSoc,2000,147:1435.

[11] WolfgangKautek,SusanneReetz,SimonePentzine.[J].ElectrochemActa,1995,40(10):1461.

[12] SunL ,SearsonPC .[J].ApplPhysLett,1999,74(19):2803.

[13] WangL ,YuZhangK ,AcetrotA ,eral.[J].ThinSolidFilms,1996,288,86.

[14] 喻敬贤,陈永言,黄清安.纳未金属多层膜的电化学制备与性能研究的现状[J].材料保护,1997,30(7):1.

[15] Muller,Bernd,Ferkel,etal.[J].Metallkd,1999,90:868.

[16] ElSherikAM ,ErbU ,PalumboG ,etal.[J].ScriptaMetallMater,1992,27:1185.

[17] AusMJ ,SzpunarB ,ErbU ,etal.[J].ScriptaMetallMater,1992,27:1639.

[18] AusMJ,SzpunarB ,etal.[J].ApplPhys,1994,75:3633.

[19] PalumboG ,DoyleDM ,El sherikAM ,etal.[J].ScriptaMetallMater,1991,25:679.

[20] RofaghaR ,LangerR ,El sherikAM ,etal.[J].ScriptaMetallMater,1994,25:2867.

[21] ElSherikAM ,BoylanK ,ErbUG ,etal.[J].SympProc,1992,238:727.

[22] TothKadarE .[P].HungarianPatent:195982,1984.

[23] BrennerA ,CouchDE ,WilliamsEK .[J].ResNatBurStand,1950,44:109.

[24] 熊毅,荆天辅,张春江,等.[J].电镀与精饰,2000,22(5):1.

[25] ImreBakonyi,EnikoTothKadar,etal.[J].SurfCoatTech,1996,78:124.

[26] NakamuraY ,KanekoN ,WatanabeM ,etal.[J].ApplElectro,1994,24:227.

[27] KajaS ,PickeringHW ,BitlerWR .[J].PlatSurfFinish,1988,1:58.

[28] McMahanG ,etal.[J].MaterSciLett,1989,8(7):865.

[29] CheungC ,ErbU .[J].MaterSciEng,A 1994,185:39.

[30] GhoshSK ,GoverAK ,DeyGK ,etal.[J].SurfCoatTech,2000,126:48.

[31] SchulzR ,etal[J].MaterRes,1998,9:2998.

[32] 严东生.[J].无机材料学报,1995,10:1.

[33] DuvailJL ,DuboisS ,PirauxL .[J].ApplPhys,1998,84(11):6359.

[34] 苏育志,龚克成.[J].材料科学与工程,1999,17(4):17.

基本信息:

DOI:10.19289/j.1004-227x.2001.04.010

中图分类号:TQ153

引用信息:

[1]邓姝皓,龚竹青,陈文汩.电沉积纳米晶体材料的研究现状与发展[J].电镀与涂饰,2001(04):35-39+50.DOI:10.19289/j.1004-227x.2001.04.010.

基金信息:

检 索 高级检索