济南大学化学化工学院;哈尔滨工业大学化工与化学学院;
[目的]开发一种基于铜镍逆置换的无钯活化瞬时启镀工艺，用以替代传统的钯活化工艺，降低印制电路板(PCB)化学镀镍的生产成本。[方法]先通过铜镍逆置换反应在铜表面形成Ni置换层，镀液组成和工艺条件为：硫酸镍40 g/L，硫脲170 g/L，硼酸30 g/L，温度60℃。随后，采用80 g/L氢氧化钠与212 g/L次磷酸钠组成的溶液，在80℃下对Ni置换层进行后处理。最后进行化学镀镍。优化了逆置换及其后处理的工艺参数。[结果]无钯活化的较优工艺为：先在硫酸浓度为0.9 mol/L的逆置换镀液中置换镀12 s，接着用碱性次磷酸钠溶液处理8 s并水洗1 s。[结论]在较优条件下，该无钯活化工艺能够实现化学镀镍的瞬时启镀，满足PCB化学镀镍的工艺要求。
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基本信息:
DOI：10.19289/j.1004-227x.2025.04.007
中图分类号:TQ153.12;TN41
引用信息:
[1]赵万成,吴波,黎德育等.基于铜镍逆置换的PCB化学镀镍的无钯活化瞬时启镀工艺[J].电镀与涂饰,2025,44(04):48-52.DOI:10.19289/j.1004-227x.2025.04.007.
基金信息: