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[目的]研究直流脉冲磁控溅射工艺参数对Au薄膜微观结构及内应力的影响规律，为制备高性能Au薄膜提供理论依据。[方法]采用直流脉冲磁控溅射法在单晶硅片上沉积Au薄膜。研究了气体压强和薄膜厚度对Au薄膜的结构及内应力的影响。通过X射线衍射仪(XRD)、原子力显微镜(AFM)和探针式表面轮廓分析仪对薄膜进行表征。[结果]磁控溅射所得Au薄膜呈(111)晶面择优取向。随气体压强增大，薄膜的生长速率先增大后减小，晶粒尺寸减小，表面粗糙度增大，内应力先减小后增大。随薄膜厚度增大，晶粒尺寸和表面粗糙度增大，应力状态由张应力转变为压应力，并逐渐减小。[结论]本研究可为优化Au薄膜的沉积工艺提供理论指导。
Abstract：[Objective] The effect of magnetron sputtering parameters on the microstructure and internal stress of Au thin films were studied to provide theoretical guidance for preparing high-performance Au films. [Method] Au thin films were deposited on single-crystal silicon substrates via pulsed magnetron sputtering. The effects of gas pressure and film thickness on the microstructure and internal stress of Au film were studied. The films were characterized by X-ray diffraction(XRD), atomic force microscopy(AFM), and probe surface profilometry. [Result] The sputtered Au films exhibited preferential(111) crystal orientation. With the increasing of gas pressure, the deposition rate was initially increased and then decreased, accompanied by reduced grain size, increased surface roughness, and internal stress showing an initial decrease followed by an increase. As film thickness increased, both grain size and surface roughness increased, while the stress state transitioned from tensile to compressive stress with gradually decreasing magnitude. [Conclusion] This research provides theoretical guidance for optimizing the deposition process of Au thin films.
[1]REN N F,HUANG L J,ZHOU M,et al.Introduction of Ag nanoparticles and AZO layer to prepare AZO/Ag/FTO trilayer films with high overall photoelectric properties[J].Ceramics International,2014,40(6):8693-8699.
[2]YANG T L,ZHANG Z S,SONG S M,et al.Structural,optical and electrical properties of AZO/Cu/AZO tri-layer films prepared by radio frequency magnetron sputtering and ion-beam sputtering[J].Vacuum,2008,83(2):257-260.
[3]MARTIN E J J,YAN M,LANE M,et al.Properties of multilayer transparent conducting oxide films[J].Thin Solid Films,2004,461(2):309-315.
[4]SAHU D R,HUANG J L.Properties of Zn O/Cu/Zn O multilayer films deposited by simultaneous RF and DC magnetron sputtering at different substrate temperatures[J].Microelectronics Journal,2007,38(3):299-303.
[5]LEE S M,KOO H W,KIM T W,et al.Asymmetric ITO/Ag/ZTO and ZTO/Ag/ITO anodes prepared by roll-to-roll sputtering for flexible organic light-emitting diodes[J].Surface&Coatings Technology,2018,343:115-120.
[6]CHEN H L,LUO X M,WANG D,et al.Achieving very high cycle fatigue performance of Au thin films for flexible electronic applications[J].Journal of Materials Science&Technology,2021,89(30):107-113.
[7]HUANG Y,QIU H,PAN L Q,et al.Effect of annealing on composition,structure and electrical properties of Au layers grown on different thickness Cr layers[J].Journal of University of Science and Technology Beijing,2004,11(3):235-239.
[8]BENDAVID A,MARTIN P J,WIECZOREK L.Morphology and optical properties of gold thin films prepared by filtered arc deposition[J].Thin Solid Films,1999,354(1/2):169-175.
[9]SEMALTIANOS N G,WILSON E G.Investigation of the surface morphology of thermally evaporated thin gold films on mica,glass,silicon and calcium fluoride substrates by scanning tunneling microscopy[J].Thin Solid Films,2000,366(1/2):111-116.
[10]许小亮,王烨,赵亚丽,等.磁控溅射法制备的纳米金薄膜的工艺条件和结构分析[J].功能材料,2006,37(8):1216-1219.XU X L,WANG Y,ZHAO Y L,et al.Growth conditions and structure analysis of nano-Au films prepared by magnetron sputtering[J].Journal of Functional Materials,2006,37(8):1216-1219.
[11]FAN D,LEI H,GUO C Q,et al.Stress study on Cr N thin films with different thicknesses on stainless steel[J].Acta Metallurgica Sinica(English Letters),2018,31:329-336.
[12]张龙,朱健,吴璟,等.磁控溅射制备低应力金属膜的工艺研究[J].中国机械工程,2005,16(14):1313-1315.ZHANG L,ZHU J,WU J,et al.Making low-stress metal thin films with magnetron sputtering[J].China Mechanical Engineering,2005,16(14):1313-1315.
[13]LIU J,XU B,WANG H,et al.Effects of film thickness and microstructures on residual stress[J].Surface Engineering,2016,32(3):178-184.
[14]FLINN P A,GRADNER D S,NIX W D.Measurement and interpretation of stress in aluminum-based metallization as a function of thermal history[J].IEEE Transactions on Electron Devices,1987,34(3):689-699.
[15]钟迪生.真空镀膜:光学材料的选择与应用[M].沈阳:辽宁大学出版社,2001:30-31.ZHONG D S.Vacuum Coating:Selection and Application of Optical Materials[M].Shenyang:Liaoning University Press,2001:30-31.
[16]MAISSEL L I,GLANG R.Handbook of Thin Film Technology[M].New York:Mc Graw-Hill,1970:12
[17]马一博,陈牧,颜悦,等.薄膜应力测量方法及影响因素研究进展[J].航空材料学报,2018,38(1):17-25.MA Y B,CHEN M,YAN Y,et al.Research progress on measurement methods and influence factors of thin-film stress[J].Journal of Aeronautical Materials,2018,38(1):17-25.
[18]QIU H,SUN J C,TIAN Y,et al.Structure and internal stress of Au films deposited on Si O2/Si(100) and mica by dc sputtering[J].Journal of University of Science and Technology Beijing,2004,11 (5):415-419.
[19]CHEN S L,SHEN B,ZHANG J G,et al.Evaluation on residual stresses of silicon-doped CVD diamond films using X-ray diffraction and Raman spectroscopy[J].Transaction of Nonferrous Metals Society of China,2012,22(12):3021-3026.
[20]刘明智,梁康,熊巍,等.沉积参数对磁控溅射镀金膜膜层残余应力与微观形貌的影响[J].导航与控制,2020,19(6):98-104.LIU M Z,LIANG K,XIONG W,et al.Effect of deposition parameters on residual stress and microstructure in magnetron sputtering Au thin films[J].Navigation and Control,2020,19 (6):98-104.
[21]唐武,徐可为,王平,等.Au/Ni Cr/Ta多层金属膜择优取向与残余应力的关系[J].金属学报,2002,38(9):932-935.TANG W,XU K W,WANG P,et al.The relationship between preferred orientation and stress in multi-layered Au/Ni Cr/Ta films[J].Acta Metallurgica Sinica,2002,38(9):932-935.
[22]SEMALTIANOS N G,WILSON E G.Investigation of the surface morphology of thermally evaporated thin gold films on mica,glass,silicon,and calcium fluoride substrates by scanning tunneling microscopy[J].Thin Solid Films,2000,366(1/2):111-116.
[23]王河,贺洪波,张伟丽.不同基底上Si O2薄膜的显微结构和力学性能[J].无机材料学报,2013,28(6):653-658.WANG H,HE H B,ZHANG W L.Substrate effects on the microstructure and mechanical properties of Si O2 thin films[J].Journal of Inorganic Materials,2013,28(6):653-658.
[24]ZHANG J M,XU K W,JI V.Dependence of stresses on grain orientations in thin polycrystalline films on substrates:an explanation of the relationship between preferred orientations and stresses[J].Applied Surface Science,2001,180(1/2):1-5.
[25]薛增泉,吴全德,李浩.薄膜物理[M].北京:电子工业出版社,1991:1-4.XUE Z Q,WU Q D,LI H,et al.Thin Film Physics[M].Beijing:Publishing House of Electronics Industry,1991:1-4.
[26]吴自勤,王兵,孙霞.薄膜生长[M].北京:科学出版社,2001:213-230.WU Z Q,WANG B,SUN X.Thin Film Growth[M].Beijing:Science Press,2001:213-230.
基本信息:
DOI：10.19289/j.1004-227x.2025.06.009
中图分类号:TB383.2
引用信息:
[1]纪建超,颜悦,哈恩华.脉冲磁控溅射低温沉积Au薄膜的微观结构和内应力研究[J].电镀与涂饰,2025,44(06):56-62.DOI:10.19289/j.1004-227x.2025.06.009.
基金信息:
国家自然科学基金（51802297）