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[目的]铜基镀银引线框架产品应用广泛，棕色氧化处理可有效提升其芯片塑封后的可靠性。[方法]研究了棕色氧化溶液中各组分浓度和工艺参数对铜基镀银引线框架产品表面粗化度的影响。检测了未经棕色氧化处理与棕色氧化处理的铜基镀银引线框架塑封后的可靠性。[结果]铜基镀银引线框架棕色氧化处理的较优溶液组成和工艺参数为：组分A 210～230 mL/L，组分B 190～210 mL/L，双氧水45～55 mL/L，传送速率1.0～1.5 m/min，循环泵频率25～35 Hz，温度35～45℃。[结论]经棕色氧化处理后，铜基镀银引线框架的表面粗化度可达到1.4以上，与芯片完成塑封后其湿度敏感性等级可达1级。
Abstract：[Objective] The silver-plated copper lead frame is widely used in industry, and brown oxidation treatment can effectively enhance its reliability after chip encapsulation. [Method] The effects of concentrations of different components in brown oxidation solution and process parameters on the surface roughness of silver-plated copper lead frame products were studied. The reliability of encapsulated lead frames, both with and without brown oxidation treatment, was tested. [Result] The solution composition and process parameters for brown oxidation were optimized as follows: component A 210-230 mL/L, component B 190-210 mL/L, hydrogen peroxide 45-55 mL/L, conveyor speed 1.0-1.5 m/min, circulation pump frequency 25-35 Hz, and temperature 35-45 °C. [Conclusion] After brown oxidation, the surface roughness of silver-plated copper lead frames reaches 1.4 or higher, and it achieves the Moisture Sensitivity Level 1(MSL-1) after chip encapsulation.
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基本信息:
DOI：10.19289/j.1004-227x.2025.10.007
中图分类号:TN405
引用信息:
[1]张坤雷,张德良,任志军,等.铜基镀银引线框架棕色氧化工艺研究[J].电镀与涂饰,2025,44(10):50-55.DOI:10.19289/j.1004-227x.2025.10.007.