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| 下载次数 | 被引频次 | 阅读次数 |
列举了多个实用的化学镀铜液配方,总结了基材表面状态、前处理及工艺条件(如温度、p H、搅拌、过滤和装载量)对化学镀铜的影响,指出了槽液配制和维护中的注意事项。
Abstract：Several practical formulations of electroless copper plating bath were presented. The effects of the surface condition of substrate, pretreatment, and process conditions such as temperature, p H, agitation, filtration, and loading capacity on electroless copper plating were summarized. Some items needing attention during bath preparation and maintenance were pointed out.
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基本信息:
DOI：10.19289/j.1004-227x.2021.02.002
中图分类号:TB306
引用信息:
[1]唐春华.现代镀覆技术 第三部分──化学镀铜（续1）[J].电镀与涂饰,2021,40(02):90-95.DOI:10.19289/j.1004-227x.2021.02.002.
2021-01-30
2021-01-30