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[目的]研究AUS SR1(干膜)、AUS 308(湿膜)和AUS 320(湿膜)三种阻焊基板在高温存储测试(HTST)后的形貌变化及其机理。[方法]基于减成法图形制程制备测试板，在150°C与175°C条件下进行HTST测试。通过金相显微镜、超声波扫描仪、扫描电子显微镜、红外光谱等手段，分析阻焊的厚度、微观形貌及固化程度。[结果]在HTST后，所有阻焊板均出现一定程度的厚度损失，损失率排序均为：AUS SR1 [Objective] To study the morphological changes and mechanisms of three different solder mask substrates, including AUS SR1(dry film), AUS 308(wet film), and AUS 320(wet film), after high-temperature storage testing(HTST). [Method] Test boards were prepared based on the subtractive graphic process. HTST tests were conducted at temperature of 150 °C and 175 °C, respectively. The thickness, micromorphology, and curing degree of the solder resists were analyzed by metallographic microscopy, ultrasonic scanning, scanning electron microscopy(SEM), and infrared spectroscopy(IR). [Result] After HTST, all packaging substrate exhibited a certain degree of thickness loss in solder resist, with the loss rates ranked as follows: AUS SR1 < AUS 320 < AUS 308. Spherical fillers in AUS 308 transformed into ellipsoidal shapes. A copper–carbon oxide composite layer formed on the circuit surface, and its thickness increased with higher test temperatures or extended durations. AUS SR1 demonstrated the best overall properties during HTST. [Conclusion] This study provides theoretical data for understanding the morphological changes of the solder mask after HTST, offering valuable insights for the selection and process design of solder resists in high-reliability packaging substrates.
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基本信息:
DOI：10.19289/j.1004-227x.2025.12.004
中图分类号:TN405
引用信息:
[1]郭亚丹,杨光,陈佳,等.不同阻焊封装基板在高温存储测试后的形貌变化及机理研究[J].电镀与涂饰,2025,44(12):19-25.DOI:10.19289/j.1004-227x.2025.12.004.
2025-08-13
2025
2025-12-31
2025
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2025-11-19
2025-11-19
2025-11-19