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[目的]为满足印制电路板(PCB)铜互连线路超细化制造对种子层精密蚀刻控制的需求，开发能够有效抑制侧蚀、提升线路质量的新型酸性蚀刻液体系至关重要。[方法]选取单独含有或同时含有杂原子、苯环、咪唑环等活性吸附中心的3种咪唑类缓蚀剂分子(咪唑、5-甲基苯并咪唑和5-甲氧基苯并咪唑)添加到酸性蚀刻液中。采用量子化学计算、分子动力学模拟和电化学测试，研究了咪唑类缓蚀剂的吸附机理及缓蚀效果。[结果]缓蚀剂分子通过O、N原子及苯环C原子作为活性中心，以平行吸附构型稳定吸附于Cu(111)面，其中5-甲氧基苯并咪唑的吸附能最低(-43.71 kcal/mol)。电化学测试结果表明，3种缓蚀剂均为以抑制阳极过程为主的混合型缓蚀剂。5-甲氧基苯并咪唑表现出最佳的缓蚀性能，缓蚀效率达40.88%，在制备线宽25μm、线距25μm的铜互连线路时的蚀刻因子可达11.53。[结论] 5-甲氧基苯并咪唑可有效抑制酸性蚀刻液对铜的腐蚀作用，提升铜互连线路的蚀刻因子。
Abstract：[Objective] To meet the requirements for precise etching control of the seed layer in the ultrafine fabrication of printed circuit board(PCB) copper interconnects, it is crucial to develop a novel acidic etching solution to effectively suppress side etching and improve line quality. [Method] Three imidazole-based corrosion inhibitor molecules(i.e imidazole, 5-methylbenzimidazole, and 5-methoxybenzimidazole) with separately or simultaneously heteroatoms, benzene rings, and imidazole rings as active adsorption centers, were added to an acidic etching solution. Quantum chemical calculations, molecular dynamics simulations, and electrochemical tests were employed to study the adsorption mechanism and corrosion inhibition performance of these imidazole-based inhibitors. [Result] The inhibitor molecules adsorbed stably on the Cu(111) plane in a parallel configuration via O and N atoms and the C atoms on benzene ring as active centers. 5-Methoxybenzimidazole exhibited the lowest adsorption energy of-43.71 kcal/mol. Electrochemical testing results indicated that all the three inhibitors were mixed-type for primarily suppressing the anodic process. 5-Methoxybenzimidazole showed the best corrosion inhibition performance, with an inhibition efficiency of 40.88%. When fabricating copper interconnects with line width/line spacing of 25 μm/25 μm, the etch factor reached 11.53. [Conclusion] 5-Methoxybenzimidazole can effectively inhibit the corrosion of copper in acidic etching solution and improve the etch factor of copper interconnects.
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基本信息:
DOI：10.19289/j.1004-227x.2026.01.007
中图分类号:TN41;TG174.42
引用信息:
[1]黎钦源,彭镜辉,梁少荣,等.咪唑类缓蚀剂在PCB铜互连线路蚀刻中的作用机制及性能研究[J].电镀与涂饰,2026,45(01):47-55.DOI:10.19289/j.1004-227x.2026.01.007.
基金信息:
四川省自然科学基金面上项目（2025ZNSFSC0382）; 国家自然科学基金面上项目（22572020）; 中国科学院科技服务网络计划──黄埔专项项目（STS-HP-202309）