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2025, 12, v.44 7-13
图形设计对铜柱电镀单元均匀性的影响
基金项目(Foundation): 江苏省科技项目(BE2022052-4)
邮箱(Email):
DOI: 10.19289/j.1004-227x.2025.12.002
摘要:

[目的]针对高散热性能基板(PHS)中导通铜柱与散热铜块因图形差异导致的电镀厚度不均匀问题,研究图形设计对电镀单元均匀性的影响,以实现对铜柱厚度的精准控制。[方法]通过正交试验,研究了图形中散热铜块尺寸、散热铜块与导通铜柱的间距及导通铜柱的干膜厚度与开窗直径之比(即图形纵横比)对铜柱电镀单元均匀性(以散热铜块与导通铜柱高度差表示)的影响,并基于多元线性回归建立预测模型。[结果]导通铜柱的图形纵横比对电镀单元均匀性影响最大,纵横比越大,电镀单元均匀性越差;其次为铜块与铜柱的间距,越小则电镀单元均匀性越差;散热铜块尺寸对电镀单元均匀性影响不显著。基于关键因素建立的预测模型拟合优度良好,具备较高的预测准确性。[结论]本研究明确了图形设计中影响铜柱电镀均匀性的关键因素及其影响规律,所建立的模型可用于预测不同图形设计下的电镀均匀性,为实际生产中的图形优化与工艺参数设定提供有效指导,有助于提升产品良率并降低生产成本。

Abstract:

[Objective] The issue of electroplating thickness non-uniformity between conductive copper pillars and heatdissipating copper blocks in plated heat spreader(PHS), which is caused by pattern design differences, was addressed in this study. The effect of pattern design on the electroplating unit uniformity was investigated, with the aim of achieving precise control over copper pillar thickness. [Method] The effects of copper block size, pillar-to-block spacing, and the aspect ratio of copper pillars(defined as the ratio of dry film thickness to opening diameter) on electroplating unit uniformity(expressed as the height difference between copper blocks and pillars), were studied via orthogonal experiments. A predictive model was established based on multiple linear regression. [Result] The aspect ratio of conductive copper pillars had the most significant impact on electroplating unit uniformity, with larger aspect ratios leading to poorer uniformity. The spacing between copper blocks and pillars was the second most influential factor, where smaller spacing resulted in reduced uniformity. In contrast, the size of the copper blocks showed no significant effect on uniformity. The predictive model developed based on key factors demonstrated good goodness-of-fit and high accuracy. [Conclusion] This research identifies the key factors in pattern design that influence copper pillar electroplating unit uniformity and clarifies their effects. The established model can predict electroplating unit uniformity under different pattern designs, providing effective guidance for pattern optimization and process parameter settings in practical production, thereby improving product yield and reducing manufacturing costs.

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基本信息:

DOI:10.19289/j.1004-227x.2025.12.002

中图分类号:TN405;TQ153

引用信息:

[1]秦华,陈先明,黄本霞,等.图形设计对铜柱电镀单元均匀性的影响[J].电镀与涂饰,2025,44(12):7-13.DOI:10.19289/j.1004-227x.2025.12.002.

基金信息:

江苏省科技项目(BE2022052-4)

投稿时间:

2025-08-14

投稿日期(年):

2025

终审时间:

2025-12-31

终审日期(年):

2025

审稿周期(年):

1

发布时间:

2025-11-20

出版时间:

2025-11-20

网络发布时间:

2025-11-20

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