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[目的]针对球栅阵列(BGA)无铅锡球在长期储存与运输过程中易氧化、磨损，导致电子产品可靠性下降的问题，对其表面进行抗氧化处理，以提高锡球表面防护性能。[方法]通过2-氨基苯并咪唑(2-ABI)与钼酸铵(AM)的协同吸附，在Sn3.0Ag0.5Cu锡球表面获得复合保护膜。通过摇球实验、高温加速氧化实验、接触角测量及剪切强度测试，研究了保护膜的机械稳定性、抗氧化性、润湿性与焊接性能。[结果]当2-ABI质量浓度为0.5 g/L、AM质量浓度为0.25 g/L时，复合膜在摇球60 min内可有效抵御表面磨损，在100°C高温氧化20 h内未形成明显的氧化层。经抗氧化处理后，纯水在Sn3.0Ag0.5Cu合金表面的接触角从初始的44.29°提高至70.29°，说明其表面由亲水转为弱疏水；焊点剪切强度略有提升。[结论]2-ABI与AM复配可在锡球表面形成致密的有机-无机复合保护膜，显著提升其抗氧化性与机械稳定性，并且不影响后续焊接性能，具备良好的工程应用前景。
Abstract：[Objective] To address the issue that lead-free ball grid array(BGA) solder balls are prone to oxidation and wear during long-term storage and transportation, leading to a decline in the reliability of electronic products, antioxidant treatment was applied to their surface to improve the protective performance of the solder balls. [Method] A composite protective film was formed on the surface of Sn3.0 Ag0.5 Cu solder ball through the synergistic adsorption of 2-aminobenzimidazole(2-ABI) and ammonium molybdate(AM). The mechanical stability, oxidation resistance, wettability, and solderability of the protective film were studied by ball-shaking test, high-temperature accelerated oxidation test, contact angle measurement, and shear strength test. [Result] The composite film formed from 0.5 g/L 2-ABI and 0.25 g/L AM could effectively resist surface wear within 60 min of shaking, and no obvious oxide layer formed after 20 hours of oxidation at 100 °C. After the antioxidant treatment, the contact angle of pure water on Sn3.0 Ag0.5 Cu alloy surface increased from 44.29° to 70.29°, indicating that the surface changed from hydrophilic to weakly hydrophobic; and the shear strength of the solder joints was slightly improved. [Conclusion] The combination of 2-ABI and AM can form a compact organic–inorganic composite protective film on the solder ball surface, which significantly enhances its oxidation resistance and mechanical stability without affecting subsequent soldering performance, demonstrating good potential for engineering applications.
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基本信息:
DOI：10.19289/j.1004-227x.2025.12.007
中图分类号:TG174.4;TN405
引用信息:
[1]林子彭,张文倩,王同举,等.Sn3.0Ag0.5Cu锡球表面2-氨基苯并咪唑与钼酸铵复合改性抗氧化膜的性能研究[J].电镀与涂饰,2025,44(12):44-50.DOI:10.19289/j.1004-227x.2025.12.007.
基金信息:
北华航天工业学院重点项目（ZD-2025-01）; 河北省高水平人才团队建设专项（244A7612D）; 廊坊市科学技术研究与发展计划自筹经费项目（2024011094）
2025-07-07
2025
2025-12-31
2025
1
2025-12-20
2025-12-20