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[目的]研究不同印刷焊料下ABF基板的焊接界面于高加速温湿度应力试验(u HAST)及高温老化试验(HTST)后的金属间化合物(IMC)生长趋势和焊接性能变化。[方法]使用扫描电子显微镜(SEM)、能谱分析仪(EDS)、多功能推拉力试验仪对焊点进行观察和分析。[结果]在u HAST及HTST试验后，化学镀锡样品的IMC层截面呈扇贝状，其俯视形貌为鹅卵石状，化学镀镍钯金(ENEPIG)样品的IMC层截面为枝晶状，其俯视形貌为多面体状。在表面处理工艺相同的情况下，采用SC07焊料时所得IMC层厚度在老化试验期间的厚度始终大于采用SAC305焊料；当焊料相同时，化学镀锡样品的IMC层厚度在老化试验期间始终大于ENEPIG样品，均未出现柯肯达尔空洞。在u HAST过程中，化学镀锡样品的焊接强度呈现下降趋势；在HTST试验过程中，化学镀锡样品的焊接强度呈现上升趋势，而ENEPIG样品的焊接强度均为先上升后下降。[结论]本研究可为ABF基板的设计提供理论参考。
Abstract：[Objective] The intermetallic compound(IMC) growth behavior and soldering performance evolution of ABF substrates with different printing solders after unbiased highly accelerated stress testing(uHAST) and high-temperature stress testing(HTST) were studied. [Method] The solder joints were observed and analyzed using scanning electron microscopy(SEM), energy dispersive spectroscopy(EDS), and a multi-function push-pull tester. [Result] After uHAST and HTST, the cross-section of the IMC layer in the immersion tin specimens exhibited a scallop-like morphology, with a pebble-like appearance in top-view. In contrast, the electrolessly nickel/electroless palladium/immersion gold(ENEPIG) specimens showed a dendritic IMC cross-section and a polyhedral top-view morphology. For the specimens treated by the same process, the IMC layer thickness with SC07 solder was consistently greater than that with SAC305 solder throughout the aging testing. For the specimens with the same solder, the IMC layer thickness in immersion tin specimens was always greater than that in ENEPIG specimens. No Kirkendall voids were observed in all specimens. During uHAST, the solder joint strength of immersion tin specimens decreased, while it increased during HTST. For the ENEPIG specimens, the solder joint strength initially increased and then decreased during HTST. [Conclusion] This study provides theoretical reference for ABF substrate design.
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基本信息:
DOI：10.19289/j.1004-227x.2025.12.005
中图分类号:TN405
引用信息:
[1]刘刚,张文健,陈佳,等.印刷焊料对ABF基板在uHAST及HTST老化后焊接可靠性的影响[J].电镀与涂饰,2025,44(12):26-35.DOI:10.19289/j.1004-227x.2025.12.005.
2025-05-27
2025
2025-12-31
2025
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2025-12-12
2025-12-12
2025-12-12