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[目的]研究十二烷基三甲基咪唑(DMIB)作为酸性硫酸盐镀液的整平剂时对盲孔电镀铜填充行为的影响，并探讨其与抑制剂聚乙二醇(PEG)和加速剂聚二硫丙烷磺酸钠(SPS)之间的协同作用机制。[方法]通过循环伏安法和计时电位法分析DMIB单独及其与PEG、SPS共存时铜电沉积的电化学行为。以扫描电镜(SEM)和X射线衍射(XRD)技术表征铜镀层的表面微观形貌与晶体结构。通过盲孔电镀实验验证其填充效果。[结果]DMIB对铜离子还原具有极化作用，且受传质控制。DMIB与PEG可协同增强对铜沉积的抑制效果，在盲孔底部尤为显著。DMIB与SPS则呈现拮抗作用，能削弱SPS的加速沉积效果。当DMIB、PEG和SPS共存时，孔口与孔底铜沉积速率差异显著，可实现盲孔致密填充，所得铜层平整致密。[结论]DMIB可作为整平剂，与PEG和SPS协同作用，实现盲孔自下而上的致密填充，并促进铜沿(111)晶面择优生长，获得光亮细致的铜镀层。
Abstract：[Objective] The effect of dodecyl trimethylimidazole bromide(DMIB) as a leveler on the blind via filling behavior during copper electroplating in an acidic sulfate bath was studied, and its synergistic mechanism with polyethylene glycol(PEG) as a suppressor and bis(3-sulfopropyl) disulfide(SPS) as an accelerator was explored. [Method] The electrochemical behavior of copper electrodeposition with DMIB alone and in combination with PEG and SPS was studied by cyclic voltammetry(CV) and chronopotentiometry. The surface micromorphology and crystal structure of the copper coatings were characterized by scanning electron microscopy(SEM) and X-ray diffraction(XRD). The blind via filling performance was verified experimentally. [Result] The copper ion reduction reaction was polarized by DMIB, which was governed by mass transfer. The inhibitory effect of PEG on copper deposition was synergistically enhanced by DMIB, with the effect being particularly pronounced at via bottom. In contrast, the accelerating effect of SPS was antagonized by DMIB. When all three additives were present, a significant disparity in the deposition rate between via mouth and bottom was achieved, enabling compact blind via filling and resulting in a smooth and compact copper coating. [Conclusion] DMIB was identified as an effective leveler. The synergy between DMIB, PEG, and SPS led to bottom-up superfilling of blind vias, preferential growth of copper along the(111) crystal plane, and a bright and fine-grained copper coating.
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基本信息:
DOI：10.19289/j.1004-227x.2025.10.002
中图分类号:TQ153.14
引用信息:
[1]金磊,宋韬,王赵云.整平剂十二烷基三甲基咪唑对盲孔电镀铜填充的影响[J].电镀与涂饰,2025,44(10):9-15.DOI:10.19289/j.1004-227x.2025.10.002.
基金信息:
重庆市教委科学技术研究计划青年项目（KJQN202401423,KJQN202501432）; 长江师范学院科研资助项目（010730153）
2025-03-17
2025
2025-11-03
2025
1
2025-10-20
2025-10-20