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近年来,化学镀铜技术在表面处理行业中所占的地位在不断地上升,在电子工业、机械工业、航空航天等各行各业都有着越来越广泛的应用。有关化学镀铜的机理研究和工艺路线改进等课题已成为当今材料表面处理研究领域的热点之一。本文介绍了化学镀铜技术的发展概况和研究进展,综述了国内外近年来在化学镀铜领域所取得的一系列新的研究成果,指出了化学镀铜技术所面临的问题和未来的主要研究方向。
Abstract：In recent years,the status of electroless copper plating technique is rising constantly in surface treating industry,which is more and more extensive applied in several fields including electronics industry,mechanical industry,aerospace,etc.The investigation on the mechanism of electroless copper plating and process improvement have become one of the most interesting topics.In this paper,the general situation and the recent research progress of electroless copper plating were introduced.Some new advanced technologies were reviewed.The future research directions were presented.
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基本信息:
DOI：10.19289/j.1004-227x.2007.04.012
中图分类号:TQ153.14
引用信息:
[1]田庆华,闫剑锋,郭学益.化学镀铜的应用与发展概况[J].电镀与涂饰,2007,No.130(04):38-41.DOI:10.19289/j.1004-227x.2007.04.012.
2007-04-15
2007-04-15