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对平均粒径为15μm的铜粉进行置换化学镀银，得到球状银包铜粉导电填料。对不同温度下银负载量随置换反应时间的变化曲线进行拟合得到不同温度下的反应速率常数，进而通过Arrhenius方程算得置换反应的活化能为1.9×103 J/mol。表征了不同温度下制备的银包铜粉的微观形貌和晶体结构，以及将其作为填料时导电胶的性能。结果表明，所得银包铜粉为银白色，银层包覆完整，分散性良好。银包铜粉的质量分数为55%时，导电胶的抗氧化性和导电性良好；银包铜粉质量分数为55%～65%时，导电胶的剪切强度满足电子工业的一般要求。
Abstract：Spherical Ag-coated Cu particles as a kind of conductive filler were prepared by replacement electroless silver plating on Cu particles with an average diameter of 15 μm. The reaction rate constants of the replacement reaction at different temperatures were obtained by fitting the variation curves of silver loading rate vs. reaction time, and the activation energy was further derived to be 1.9 × 103 J/mol according to the Arrhenius equation. The micromorphologies and crystal structures of Ag-coated Cu particles obtained at different temperatures were characterized, and the properties of the conductive adhesives prepared with the Ag-coated Cu particles were examined. The results showed that the Ag-coated Cu particles were silvery white and dispersed well with complete silver coating. The conductive adhesive with 55%(mass fraction) Ag-coated Cu particles featured excellent oxidation resistance and conductivity. The shear strength of the conductive adhesive prepared with Ag-coated Cu particles in a range of mass fraction from 55% to 66% met the common requirement of electronic industry.
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基本信息:
DOI：10.19289/j.1004-227x.2022.05.010
中图分类号:TG174.4;TN04
引用信息:
[1]孙志,于晓辉,娄鑫梨,等.置换化学镀法制备银包铜粉导电胶填料及其性能[J].电镀与涂饰,2022,41(05):352-359.DOI:10.19289/j.1004-227x.2022.05.010.
基金信息:
嘉兴市科技计划项目（2019AD32017,2020AD10017,2020AY10008）
2022-03-15
2022-03-15