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[目的]研发适用于6061铝合金化学镀光亮镍的二次浸锌前处理配方，优化二次浸锌及退锌的工艺参数，以获得表面均匀、薄而致密的锌置换层，为后续化学镀光亮镍提供良好的基底。[方法]通过扫描电子显微镜、能谱仪及激光共聚焦显微镜，研究了浸锌液中FeCl3浓度、表面活性剂种类及浓度一次浸锌时间、退锌时间、二次浸锌时间对浸锌层形貌、成分和表面粗糙度的影响，并对化学镀Ni–P合金层的微观形貌、光泽度、结合力等性能进行表征。[结果]较优的浸锌配方为：氧化锌6 g/L，氢氧化钠60 g/L，酒石酸钾钠15 g/L，三氯化铁1 g/L，聚乙二醇6000(PEG 6000)500 mg/L。较优的前处理工艺参数为：一次浸锌40 s，退锌3 s，二次浸锌20 s。采用该工艺可在6061铝合金表面获得均匀致密的浸锌层。后续化学镀镍1 h所得Ni–P合金镀层呈镜面光亮(光泽度为502 GU)，厚度均匀(平均值13.5μm，变异系数1.22%)，结合力达0级，微观组织致密、无缺陷。[结论]对铝合金进行适当的预处理有利于后续化学镀得到性能优异的Ni–P合金镀层，本研究为铝合金化学镀前处理提供了可靠的方案。
Abstract：[Objective] To develop a secondary zinc dipping pretreatment formulation for electroless bright nickel plating on 6061 aluminum alloy, optimize the process parameters of secondary zinc dipping and zinc stripping, and obtain a uniform, thin, and compact zinc displacement layer as a favorable substrate for subsequent electroless bright nickel plating. [Method] The effects of FeCl3 concentration and surfactant type and concentration in zinc dipping solution, first zinc dipping time, zinc stripping time, and secondary zinc dipping time on the morphology, elemental composition, and surface roughness of the zinc immersion layer were studied using scanning electron microscopy(SEM), energy-dispersive spectroscopy(EDS), and laser confocal scanning microscopy(LCSM). The microstructure, glossiness, and adhesion of the electrolessly plated Ni–P alloy coating were characterized. [Result] The zinc dipping formulation was optimized as follows: zinc oxide 6 g/L, sodium hydroxide 60 g/L, potassium sodium tartrate 15 g/L, ferric chloride 1 g/L, and polyethylene glycol 6000(PEG 6000) 500 mg/L. The optimized pretreatment process parameters were as follows: first zinc dipping for 40 s, zinc stripping for 3 s, and second zinc dipping for 20 s. With this process, a uniform and compact zinc dipping layer was obtained on the 6061 aluminum alloy surface. The subsequent Ni–P alloy coating obtained after 1 hour of electroless plating exhibited a mirror-bright appearance(glossiness of 502 GU), uniform thickness(average value of 13.5 μm, coefficient of variation of 1.22%), adhesion rated as class 0, and a compact and defect-free microstructure. [Conclusion] Appropriate pretreatment of aluminum alloy facilitates the subsequent electroless plating to obtain Ni–P alloy coatings with excellent performance. This study provides a reliable pretreatment scheme for electroless nickel plating on aluminum alloys.
[1]李剑斌,郭兴红.水合氯醛对光亮镍镀层性能的影响[J].电镀与涂饰, 2022, 41(21):1505-1509.LI J B, GUO X H. Effect of chloral hydrate on properties of electroplated bright nickel coating[J]. Electroplating&Finishing, 2022,41(21):1505-1509.
[2]张业明,方达经,陈志亮,等.镁合金化学镀光亮镍磷合金[J].腐蚀与防护, 2009, 30(5):332-334.ZHANG Y M, FANG D J, CHEN Z L, et al. Technology of electroless Ni–P deposition on magnesium alloy[J]. Corrosion and Protection,2009, 30(5):332-334.
[3]KUO L C, HUANG Y C, LEE C L, et al. The activation effect of Pd nanoparticles on electroless nickel–phosphorous deposition[J].Electrochimica Acta, 2006, 52(1):353-360.
[4]安美特德国有限公司.非电解镀镍的预处理方法:201080013774.8[P]. 2012–04–04.ZETTELMEYER E. Pre-treatment process for electroless nickel plating:CN102405306[P]. 2012–04–04.
[5]深圳市创智成功科技有限公司.一种用于PCB电路板化学镍金的钯活化方法:CN202110238810.0[P]. 2021–06–29.YAO J H, CHEN J L. Palladium activation method for electroless nickel immersion gold of PCB:CN113046733[P]. 2021–06–29.
[6]广东工业大学.一种抑制集成电路封装柔性基板超细线路化学镀镍渗镀和漏镀的方法和应用:CN202510973244.6[P]. 2025–09–26.HAO Z F, QIN W H, LI J J, et al. Method and application for suppressing electroless nickel plating and leakage plating of ultra-fine line electroless plating of integrated circuit packaging flexible substrate:CN120700481[P]. 2025–09–26.
[7]肖鑫,许律,刘万民.铝及铝合金全光亮化学镀镍磷合金工艺优选[J].材料保护, 2011, 44(3):64-67, 91.XIAO X, XU L, LIU W M. Technology for electroless bright nickel–phosphorous alloy plating on aluminum and aluminum alloy[J].Materials Protection, 2011, 44(3):64-67, 91.
[8]胡光辉,王斌,崔子雅,等.活化工艺对铝合金化学镀镍的影响[J].电镀与涂饰, 2021, 40(19):1477-1482.HU G H, WANG B, CUI Z Y, et al. Effects of different activation processes on electroless nickel plating of aluminum alloy[J].Electroplating&Finishing, 2021, 40(19):1477-1482.
[9]邓银,张胜涛,苏新虹,等.前处理对化学沉镍金金面外观影响的研究[J].印制电路信息, 2011(11):42-45, 51.DENG Y, ZHANG S T, SU X H, et al. Study on impact of different pretreatments on gold surface appearance in electroless nickel immersion gold process[J]. Printed Circuit Information, 2011(11):42-45, 51.
[10]程林凯,兀文博,梁民,等. 6061铝合金化学导电氧化后颜色不均原因分析及解决措施[J].机械研究与应用, 2025, 38(1):135-137.CHENG L K, WU W B, LIANG M, et al. Analysis and solution measures for uneven color of 6061 aluminum alloy after chemical conductive oxidation[J]. Mechanical Research&Application, 2025,38(1):135-137.
[11]朱卓敏,王宗雄,储荣邦.光亮镀镍常见故障处理及镀液维护方法[J].电镀与涂饰, 2017, 36(11):577-586.ZHU Z M, WANG Z X, CHU R B. Troubleshooting for bright nickel electroplating and its bath maintenance[J]. Electroplating&Finishing,2017, 36(11):577-586.
[12]宿辉,张迎,原小寓,等. 2024铝合金直接化学镀镍工艺及镀层性能[J].电镀与涂饰, 2023, 42(1):24-30.SU H, ZHANG Y, YUAN X Y, et al. Direct electroless nickel plating on2024 aluminum alloy and properties of the coating[J]. Electroplating&Finishing, 2023, 42(1):24-30.
[13]武剑,陈阵,司云森,等. 1060铝材两步化学浸锌工艺[J].材料保护, 2011, 44(5):37-39.WU J, CHEN Z, SI Y S, et al. Two-step electroless zinc plating process of 1060 aluminum[J]. Materials Protection, 2011, 44(5):37-39.
[14]毕晨,刘定富,曾庆雨. 2A12铝合金化学镀镍前处理工艺研究[J].贵州科学, 2016, 34(3):88-92.BI C, LIU D F, ZENG Q Y. A study on pretreatment process of electroless nickel plating on 2A12 aluminum alloy[J]. Guizhou Science,2016, 34(3):88-92.
[15]常德华.铝合金电镀前处理技术探究[J].冶金与材料, 2022, 14(1):67-68.CHANG D H. Study on pre-treatment technology for aluminum alloy electroplating[J]. Metallurgy and Materials, 2022, 14(1):67-68.
[16]张娟,连忠平,袁景追,等.二次浸锌预处理对钛合金化学镀镍沉积行为和镀层结合力的影响[J].电镀与涂饰, 2022, 41(19):1382-1388.ZHANG J, LIAN Z P, YUAN J Z, et al. Effect of secondary zinc dipping as a pretreatment on electroless deposition behavior of nickel on titanium alloy and adhesion of the coating obtained thereon[J].Electroplating&Finishing, 2022, 41(19):1382-1388.
[17]黄晓梅,张密林.铝及其合金浸锌溶液用表面活性剂的优选[J].腐蚀科学与防护技术, 2007, 19(5):333-337.HUANG X M, ZHANG M L. Optimization of surface active agents of zinking bath for aluminum and its alloys[J]. Corrosion Science and Protection Technology, 2007, 19(5):333-337.
[18]王伟.铝带材电镀薄镍层工艺的研究[D].哈尔滨:哈尔滨工业大学, 2022.WANG W. Research on electroplating thin nickel layer technology on aluminum strip[D]. Harbin:Harbin Institute of Technology, 2022.
基本信息:
DOI：10.19289/j.1004-227x.2026.04.005
中图分类号:TG174.4
引用信息:
[1]李峻杰,王世春,秦伟恒,等.6061铝合金化学镀光亮镍前处理工艺[J].电镀与涂饰,2026,45(04):31-40.DOI:10.19289/j.1004-227x.2026.04.005.
2025-11-05
2025
2026-04-28
2026
2026-04-22
1
2026-03-27
2026-03-27
2026-03-27