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近10年来甲基磺酸已广泛替代氟硼酸应用于电子设备表面锡焊电沉积领域,其它一些涉及铅的电化学工艺,如贝特工艺电解精炼铅等,目前多采用氟硅酸体系电解液。由于甲基磺酸(MSA)体系电解液在环保方面具有明显优势,越来越多以MSA替代现有电解液方面的研究。另外,市场上部分钢板镀锡工艺也转向采用甲基磺酸镀锡电解液。此外,在镀银、镀镍、镀铜、镀镉及镀锌等领域,MSA的应用市场也在不断发展。本文介绍了甲基磺酸的化学、物理特性,及其在金属精饰方面的应用和优势。
Abstract：During the past ten years, methanesulphonic acid has largely replaced fluoroboric acid as the electrolyte of choice for the electrodeposition of tin and tin-lead solder on electronic devices. Certain other electrochemical processes involving lead, most notably the electrorefining of lead by the Bett's process, are currently carried out in fluorosilicic acid based electrolytes but those based on methanesulphonic acid (MSA) are being actively investigated as environmentally superior alternatives to the currently used systems. Also, a number of commercial strip steel tin-plating operations have recently converted to methanesulphonic acid based tin-plating electrolytes. There are also developing markets for methanesulphonic acid in silver, nickel, copper, cadmium and zinc electroplating. This paper reviews the chemical and physical properties of methanesulphonic acid and its current applications in the field of metal finishing and also its superiority over other electrolytes especially with respect to environmental pollution.
[1] NobelFI,PointS,OstrowB,etal.Bathandprocessforplatingleadandlead/tinalloys[P].USPatent:4565610,1986-01-21.
[2] NobelFI,PointS,OstrowB,etal.Bathandprocessforplatingtin,leadandtin leadalloys[P].USPatent:4565609,1986-01-21.
[3] NobelFI,PointS,OstrowB,etal.Processandelectrolyteforelectroplatingtin,leadortin leadalloys[P].USPatent:4617097,1986-10-14.
[4] Kirk Othmer.EncyclopediaofChemicalTechnology.4thEdition[M],USA:JohnWiley＆Sons,1997.23.
[5] MartinJL,TobenMP.AESFSUR/FIN'88[C].LosAngeles,CA,1988,E-3.
[6] ProellW.USPatent:2525493,1950.
[7] PaulRC,KapilaVP,SharmaSK.[J].IndJChem,1974(12):651.
[8] GernonMD,WuM,ThomasBuszta,etal.[J].GreenChem,1999(6):127.
[9] ProellWA,AdamsCE,ShoemakerBH.[J].IndEngChem,1948,40:1129.
[10] ChenJC.Selectiveelectrolyticstrippingofmetalcoatingsfrombasemetalsubstrates[P].USPatent:4678552,1987-07-07.
[11] HiranoS,OyagiY,IzakiT.StudyofHCDElectroplatingbyPhenolsulfonicAcidBaths[J].PlatSurfFinish,1997,84(7):54.·44·
[12] TamTM.[J].JElectrochemSoc,1986,133:1792.
[13] SmirnovMI,TyutinaKM,PopovAN.[J].RussJElectrochem,1995,31:498.
[14] YauYH.AComparativeStudyofHalogen＆MethanesulfonicAcidElectrotinningProcess[J].PlatSurfFinish,1999,86(8):48.
[15] KunihiroT,MorimitsuM,MatsunagaM.[J].JApplElectrochem,2000,30:359.
[16] KohlPA.[J].JElectrochemSoc,1982,129:1196.
[17] DereshL.LowFoamingSolderPlatingElectrolytes[J].MetFin,1990,88(1):23.
[18] RinneCL,HrenJJ,FedkiwPS.[J].JElectrochemSoc,2002,149(3):151.
[19] RosensteinC,MethaneSulfonicAcidasanElectrolyteforTin,LeadandTin LeadPlatingforElectronics[J].MetFin,1990,88(1):17.
[20] CapelatoD,NobregaJA,NevesFA.[J].JApplElectrochem,1995,25:408.
[21] HsuenWL,WanCC.[J].BullElectrochem,1990,6(9):790.
[22] LinKL,HsuKT.ElectrodepositionBehaviorsofSolderBumpsfromFluoroborate＆SulfonateBsths[J].PlatSurfFin,2000,87(3):86.
[23] LinQ,SheppardKG,DattaM,etal.[J].JElectrochemSoc,1992,139:L62.
[24] ChinDT,SunkaraMK.SelectivePulsePlatingofGoldandTin LeadSolder[J].PlatSurfFin,1991,78(2):57.
[25] DossSK.Platingof60/40Tin/LeadSolderforHeadTerminationMetallurgy[J].PlatSurfFin,1997,84(1):38.
[26] JordanM.Lead FreeTinAlloysasSubstitutesforTin LeadAlloyPlating[J].TransInstMetFin,1997,75(4):149.
[27] Katayama,J,OkunoK,IzakiM.SolderabilityofBismuth/TinDoubleLayerDeposits[J].MetFin,1996,94(1):12.
[28] KondoT.BrightTin SilverAlloyElectrodepositionfromanOrganicSulfonateBathContainingPyrophosphate,Iodide＆TriethanolamineasChelatingAgents[J].PlatSurfFin,1998,85(2):51.
[29] JordanM.ElectroplatedLead FreeTinAlloysforElectronics ResultsfromFieldTests[J].TransInstMetFin,2002,86(3):97.
[30] HuttunenE,Saarivirta.[J].SurfCoatTech,2002,160:288.
[31] Huttunen SaarivirtaE,TiainenT,LepistoT.[J].MatSciEng,2002,A336:52.
[32] KondoT,Tetsuya,MasakiS,etal.SilverPlatingfromSilverMethanesulfonate PotassiumIodideBath[J].MetFin,1991,89(10):32.
基本信息:
DOI：10.19289/j.1004-227x.2004.05.011
中图分类号:TQ153;TG176
引用信息:
[1]R. Balaji , Malathy Pushpavanam ,罗慧梅.甲基磺酸在电镀相关金属精饰领域的应用[J].电镀与涂饰,2004(05):40-45.DOI:10.19289/j.1004-227x.2004.05.011.
2004-10-25
2004-10-25