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[目的]针对传统钯活化工艺易刻蚀铜球基体且成本较高的问题，提出铝接触镍活化后化学镀Ni–P合金工艺，旨在实现不同尺度(亚微米、微米及毫米)铜球表面具有优异防护性能Ni–P合金镀层的制备。[方法]通过铝接触镍活化在亚微米、微米及毫米铜球表面制备了纯Ni活化层，再经化学镀沉积了完整致密Ni–P合金镀层。利用扫描电子显微镜(SEM)、能量色散谱仪(EDS)、X射线衍射仪(XRD)和聚焦离子束双系统(FIB–SEM)研究了镀层的表面和截面形貌、化学成分及相结构。通过同步热分析仪(TG)和电感耦合等离子体发射光谱仪(ICP–OES)研究了铜球沉积Ni–P合金镀层前后的抗氧化和耐腐蚀性能。[结果]不同尺度铜球表面均获得了完整、致密且结合良好的非晶态Ni–P合金镀层，镀层呈典型的胞状结构，Ni、P元素分布均匀，形成明显的核-壳结构。[结论]铝接触镍活化可有效避免铜球基体腐蚀，显著降低活化成本；所制备的Ni–P合金镀层具有优异的抗氧化与耐腐蚀性能。本研究为多尺度铜球表面防护提供了新工艺途径。
Abstract：[Objective] To address the issues of substrate etching and high cost associated with conventional palladium activation, an aluminum-contact nickel activation followed by electroless Ni–P plating process was proposed, aiming to prepare protective Ni–P alloy coatings with excellent performance on copper spheres of different sizes(submicron, micron, and millimeter). [Method] A Ni activation layer was firstly deposited on the surfaces of submicron-, micron-, and millimeter-sized copper spheres via aluminum-contact nickel activation, followed by the deposition of continuous and compact Ni–P alloy coatings through electroless plating. The surface and cross-sectional morphologies, chemical composition, and phase structure of the coatings were studied using scanning electron microscopy(SEM), energydispersive spectroscopy(EDS), X-ray diffraction(XRD), and focused ion beam scanning electron microscopy(FIB–SEM). The oxidation resistance and corrosion resistance of the copper spheres before and after Ni–P alloy deposition were studied through thermogravimetric analysis(TG) and inductively coupled plasma optical emission spectroscopy(ICP–OES). [Result] Complete, compact, and well-bonded amorphous Ni–P alloy coatings were obtained on copper spheres of all scales. The coatings exhibited a typical nodular structure, with uniform distribution of Ni and P elements, forming a distinct core–shell structure. [Conclusion] The aluminum-contact nickel activation effectively avoids corrosion of copper substrate while significantly reducing activation costs. The prepared Ni–P alloy coatings demonstrate excellent oxidation and corrosion resistance. This study provides a new process route for surface protection of copper spheres across multiple scales.
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基本信息:
DOI：10.19289/j.1004-227x.2026.04.001
中图分类号:TQ153.2
引用信息:
[1]周胜名,魏巍,廖万达,等.基于铝接触镍活化的铜球化学镀镍-磷合金工艺及其防护性能[J].电镀与涂饰,2026,45(04):1-8.DOI:10.19289/j.1004-227x.2026.04.001.
基金信息:
国家自然科学基金面上项目(52571116); 甘肃省重点研发计划项目(24YFGC001)
2025-12-22
2025-12-22
2025-12-22